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| BAP70AM Silicon PIN diode array Rev. 01 -- 20 November 2006 Product data sheet 1. Product profile 1.1 General description Four planar PIN diode array in SOT363 small SMD plastic package. 1.2 Features I I I I High voltage current controlled RF resistor for RF attenuators Low diode capacitance Very low series inductance Low distortion 1.3 Applications I RF attenuators I (SAT) TV applications I Car radio applications 2. Pinning information Table 1. Pin 1 2 3 4 5 6 Discrete pinning Description anode diode 1 cathode diode 2 anode diode 3 / cathode diode 4 anode diode 4 cathode diode 3 anode diode 2 / cathode diode 1 1 2 3 1 2 3 sym118 Simplified outline 6 5 4 Symbol 6 5 4 3. Ordering information Table 2. Ordering information Name BAP70AM Description plastic surface-mounted package; 6 leads Version SOT363 Type number Package NXP Semiconductors BAP70AM Silicon PIN diode array 4. Marking Table 3. BAP70AM Marking Marking code N9 Type number 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF Ptot Tstg Tj Parameter reverse voltage forward current total power dissipation storage temperature junction temperature Tsp = 90 C Conditions Min -65 -65 Max 50 100 300 +150 +150 Unit V mA mW C C 6. Thermal characteristics Table 5. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 260 Unit K/W BAP70AM_1 (c) NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 20 November 2006 2 of 7 NXP Semiconductors BAP70AM Silicon PIN diode array 7. Characteristics Table 6. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF IR Cd Parameter forward voltage reverse current diode capacitance Conditions IF = 50 mA VR = 50 V see Figure 1; f = 1 MHz; VR = 0 V VR = 1 V VR = 5 V VR = 20 V rD diode forward resistance see Figure 2; f = 100 MHz; IF = 0.5 mA IF = 1 mA IF = 10 mA IF = 100 mA L charge carrier life time when switched from IF = 10 mA to IR = 6 mA; RL = 100 ; measured at IR = 3 mA IF = 100 mA; f = 100 MHz Min 77 40 5.4 1.4 1.25 100 50 7 1.9 s 570 400 270 200 250 fF fF fF fF Typ 0.9 Max 1.1 <100 Unit V nA LS series inductance - 0.6 - nH 600 Cd (fF) 500 001aaa461 103 rD () mce007 102 400 10 300 200 0 5 10 15 VR (V) 20 1 10-1 1 10 IF (mA) 102 f = 1 MHz; Tj = 25 C. f = 100 MHz; Tj = 25 C. Fig 1. Diode capacitance as a function of reverse voltage; typical values Fig 2. Diode forward resistance as a function of forward current; typical values BAP70AM_1 (c) NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 20 November 2006 3 of 7 NXP Semiconductors BAP70AM Silicon PIN diode array 8. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 3. Package outline SOT363 BAP70AM_1 (c) NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 20 November 2006 4 of 7 NXP Semiconductors BAP70AM Silicon PIN diode array 9. Abbreviations Table 7. Acronym PIN SMD RF SAT Abbreviations Description P-type, Intrinsic, N-type Surface Mounted Device Radio Frequency Satellite 10. Revision history Table 8. Revision history Release date 20061120 Data sheet status Product data sheet Change notice Supersedes Document ID BAP70AM_1 BAP70AM_1 (c) NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 20 November 2006 5 of 7 NXP Semiconductors BAP70AM Silicon PIN diode array 11. Legal information 11.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 11.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com BAP70AM_1 (c) NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 20 November 2006 6 of 7 NXP Semiconductors BAP70AM Silicon PIN diode array 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 3 4 5 5 6 6 6 6 6 6 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 November 2006 Document identifier: BAP70AM_1 |
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